Greene Tweed has announced the introduction of Chemraz® 663, a new compression-molded perfluroroelastomer (FFKM), engineered to withstand low-temperature Etch and Deposition applications where plasma resistance and maintaining sealing force in a vacuum are critical, such as electrostatic chuck (ESC) assemblies.
With its low-temperature operating capacity (as low as -40°C/-40°F) and high purity (trace metal content less than 20,000 ppb),Chemraz® 663 is an ideal choice for ESC applications and low-temperature vacuum environments.
“Chemraz® 663 was engineered to be the lowest temperature-capable FFKM on the Semiconductor market,” said Andy Johnson, Semiconductor Product Manager at Greene Tweed. “If you’re looking for high-performing plasma material with excellent low-temperature capability, Chemraz® 663 is the ideal choice.”
To learn more about Chemraz® 663, visit this page.
About Greene Tweed
Greene Tweed is a leading global manufacturer of high-performance thermoplastics, composites, seals, and engineered components. Combining more than 150 years of technical expertise and commercial knowledge in a variety of markets, Greene Tweed collaborates with customers to develop engineered solutions that meet challenging performance requirements and reduce total cost of ownership.